SAE Circuits News

December 21st 2009 - SAE purchases a new Circuit Automation Soldermask Curtain Coater for improved deposition of soldermask.

December 15th 2009 - SAE installs a new IPS Developer to enhance our ability to process thinner inner layer cores with more controlled line width. This new developer will improve our yields on thin core processing and help to keep our pricing competitive on advanced technology orders.

April 24 2009 - SAE Circuits Colorado. Inc. has received UL approval for the fabrication of multilayer boards with GETEK materials. The company received this approval after qualifying through the more rigorous 10-day UL test. The 10 day-test requires a much more robust product than the standard 56-day UL test, assuring the qualifying company or entity of superior board quality and robustness.
Over the last 2-3 years, SAE Circuits Colorado, Inc. has acquired extensive experience with multilayer builds of RF materials such as GETEK, ARLON, and ROGERS materials. In most of these cases the builds are for low voltage RF applications, but the GETEK material has now been approved by UL for standard voltage applications.

March 7th, 2009 - SAE Circuits receives ITAR Certification. ITAR (International Traffic in Arms Regulations) is a set of United States government regulations that control the export and import of defense-related articles and services on the United States Munitions List. The Department of State interprets and enforces ITAR. Its goal is to advance national strategic objectives and U.S. foreign policy via the trade controls. For more information on ITAR go to www.pmddtc.state.gov. - SAE’s ITAR registration letter (PDF).

January, 2009 - SAE Installed a new Integrated Process Technologies (IPS) outer layer etcher /Tin Stripper and IPS Inner layer etcher/resist stripper. This new equipment will allow us to increase our capabilities to process thinner cores, smaller lines and traces, helping us to gain greater control on orders with impedance requirements.

November 7, 2008 - SAE takes delivery of a new preclean line and inner layer prep line. This multi-chamber process line will increase our capability for thinner inner layer cores, and will improve inner layer processing and outer layer surface preparation prior to solder mask, all part of our aggressive continuous improvement program.

October 7th 2008 - SAE Circuits took delivery of two Excellon HVP drills. They are both six spindle machines with high speed spindles, broken bit detection and z-axis control. The improvements to drilled hole accuracy, drill density and speed will enable us to better support our customers design requirements. The addition of z-axis control will enable SAE to expand our HDI capabilities and open up new market opportunities. These machines, in conjunction with the new etch/strip lines that are anticipated for late November delivery are part of an overall strategy to improve density capabilities and better support our customer design requirements.

June 27th 2008 - SAE Circuits orders 2 Excellon HPV drills. SAE Circuits has placed an order with Enterprise Technologies Incorporated (ETI) for two Excellon HPV 6 station drills. The purchase eases capacity requirements while supporting the need for smaller holes and addresses the industry's move towards smaller and tighter PCB technologies.

December 14th 2007 - SAE Circuits upgrades wet process equipment. SAE has purchased a Chemcut Resist Stripping Line and Deburring Line to enhance our fine line capabilities. This purchase supports our customers ever increasing fine line technology requirements.

June 6th 2007 - SAE installs a Trionetics Reverse Osmosis Water Treatment System for better process control. This equipment will allow us to use purified water in our wet processes at a much lower cost per gallon helping SAE to remain a competitive supplier of printed circuit boards.

February 13th 2007 - SAE Circuits purchases a new IPS automated electroless copper line. This equipment will support our customer's requirements for smaller hole technology and ensure consistent process control.

October 12th 2006 - SAE Circuits has promoted Stelios Androulidakis to Process Engineer and hired David Denman as Environmental Health & Safety Manager. Having both Stelios and David on staff as degreed chemical engineers will help SAE transition to the next level of technology. Stelios has been with SAE for over 10 years as the Environmental Health & Safety Manager. His leadership has helped build SAE into a supplier of choice for many high technology companies. David Denman comes to SAE from Circuit Images were he held a similar position. David brings 25 years of experience in the printed circuit board manufacturing industry to SAE.