Filled Vias, Blind/Buried Vias & Sequential Lamination

A “via” is a general term used on the industry for a “via hole” as opposed to a through-hole or component hole, where a lead for a component would normally be inserted. A “via” hole is only utilized to carry a signal to a different layer, and is highly utilized in SMT (Surface Mount Technology).

Our service includes filled, blind, buried, and sequentially laminated vias as required by design.

We have in-house capability to do an 80-90% non-conductive filled via from either the primary or secondary side of the board. This feature is perfect for designs that need better vacuum table adhesion during automated assembly, or for designs that utilize L.E.D. or photo-detection cells and require light shielding side to side.

For via-in-pad technology, we have recently installed new MASS via fill and planarization equipment which allows us to produce this type of technology in-house. Since the entire integrity of a highly complicated board can hinge on the success and quality of a via-in-pad process, we inspect the product prior to and immediately after either non-conductive, or conductive via fill and planarization. Bringing this technology in-house allows us to provide filled VIA boards in as little as three day turns.

Blind vias are sequentially laminated in-house. Blind micro-vias that require controlled depth drilling must be examined on a case-by-case basis by our engineering crew. The addition of our new Schmoll drill machines allows for the manufacturing of very dense controlled depth designs using the capacitance-based depth control capability of the drills machines. We do have the ability to sequentially laminate blind vias of varying depths from either side of a board. Additionally, we can do this in combination with buried vias, which are also built using sequential lamination procedures and controlled depth blind vias.

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